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1 Mission

Simplifying processor upgrades and securing investments – that is our mission for your business success: with the interchangeable phyFLEX System on Modules, based on FPSC.

3 signal categories

The FSPC footprint classifies signals into three categories, allowing their pinout to be assigned flexibly yet in a standardized way – saving development time and costs. 

100% Future Proof

phyFLEX and FPSC ensure future-proofing: The pin-compatible modules of a feature set enable product variants and upgrades without loss of functionality.

phyFLEX –
The future-proof embedded platform for sustainable success


In a fast-moving technology industry, one thing matters above all: investments that have a long-term impact.
With the phyFLEX System on Modules, PHYTEC makes your development processes more sustainable, faster and more cost-effective.

  • Interchangeable System on Modules
    for scalable computing power and variants – with just one carrier board and without redesign.
  • Uniform footprint
    for easy module replacement, durable platform designs and maximum investment security.
  • Minimized development risk
    through standardized interfaces and proven architecture.
  • Fast market access
    through easy integration into existing and new designs.

Secure your technological advantage – with phyFLEX today and in the future.

FPSC – the footprint for robust, price- and series-optimized designs

Simplified development through 3 signal categories

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phyFLEX modules feature guaranteed mandatory signals for maximum compatibility, which are identical across all current and future modules within a feature set. To simplify the selection of the appropriate phyFLEX SoM, subclasses are available for typical applications such as vision, HMI, and industrial networking.

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Optional Signals include signals that are currently supported by many processors and will also be considered for future System on Modules of the FPSC feature set.

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The third level enables the use of processor features that are not subject to standardization and are therefore unique to a processor. This also allows the use of special and new processor features.

By using Mandatory and Optional Signals, which together account for over 80 percent of all signals, module replacement is guaranteed in the long term and without changes to the carrier board.

FTGA soldering technology for highest quality and reliability

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  • Particularly stable board-to-board solder connections
  • Double-sided solder reservoirs minimize the risk of faulty solder joints
  • Minimal coplanarity deviations
  • Extreme stress and vibration resistance (EN 60068-2 series of standards)
  • Particularly high production yield
     

Three sizes for maximum scalability

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According to the FPSC standard, no fixed PCB sizes or module aspect ratios are defined for phyFLEX modules in the Gamma feature set. However, there are three different size recommendations for the footprint design.

  • Size S: The smallest SoM footprint, suitable for modules with medium power and basic functions. Recommended size: 40 x 37 mm

  • Size M:This footprint was specifically designed for high-performance modules. It can also accommodate size S modules, but not size L modules. Recommended size: 48 x 45 mm

  • Size L: The largest available footprint offers the greatest flexibility, as it can accommodate all available module sizes. This format is particularly future-proof, as it allows for easy upgrades to modules with greater functionality. Recommended size: 53 x 50 mm

All modules with the same feature set are pin compatible and interchangeable.

Minimal complexity and lower costs for your carrier board

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  • EMC-critical components such as processor, memory, etc. on the SoM
  • A 6-layer baseboard design is usually sufficient.
  • Drilled via technology
  • 100µm Line and Space: 2 signal lines between 2 pads
  • Optimized signal integrity of differential signals

SoMs with FPSC footprint enable price savings of up to 70% for the development and production of your carrier board!

Choose your System on Module according to application area

The mandatory signals of the FPSC standard are divided into subclasses.
This makes it easier to select suitable FPSC SOMs for applications such as image processing, HMI or industrial networks.

Subclass 1 = Vision | Guaranteed feature: MIPI CSI-2 Interface

Subclass 2 = HMI | Guaranteed feature: LVDS display Interface

Subclass 3 = Industrial networking | Guaranteed Features: CAN(FD), RGMII

  phyFLEX-i.MX 95phyFLEX-i.MX 8M PlusphyFLEX-STM32MP2phyFLEX-AM62LxphyFLEX-i.MX 93phyFLEX-i.MX 91
Subclass 1 / 2 / 3 1 / 2 / 3 1 / 2 / 3 2 / 3 1 / 2 / 3 3
Featureset Gamma Gamma Gamma Gamma Gamma Gamma
Sizes M / L S / M / L   S / M / L    
RGMII x x x x x x
Ethernet x x x x x x
USB 2.x x x x x x x
USB 2.x x x x x x x
LVDS x x x x x NA
MIPI-CSI x x x NA x NA
SD Card x x x x x x
QSPI x x x x x x
CAN(-FD) (2) x x x x x x
UART+Flow (2) x x x x x x
UART x x x x x x
SPI+CS (2) x x x x x x
I2C (2) x x x x x x
PWM (2) x x x x x x
SAI 2-Lane x x x x x x
JTAG x x x x x x
PWR_IN x x x x x x
Control/Misc x x x x x x
GPIO (4) x x x x x x
USB 3.x (1-2) 1 2 1 O O O
LVDS 1 1 1 O O O
MIPI-DSI 1 1 1 1 1 O
MIPI-CSI (1-4) 1 1 O O O O
HDMI/eARC O 1 O O O O
PCIe 2-Lane (1-2) 2 1 1 O O O
CAN(-FD) O O O 1 O O
SDIO4 1 1 1 1 O O
SPI+CS 1 1 1 1 O O
I2C (1-2) 1 1 2 1 O O
PWM (1-2) 2 2 2 2 O O
ADC (1-8) 8 O 4(5) 4 4 4
GPIO (1-3) 3 3 3 3 O O
10G Ethernet 1 O O O O O
USB 3 SS Signals 1 O 1 (or PCIe) O O O
GPIO 1 4 4 4 O O

Available phyFLEX System on Modules and Development Kits

Downloads

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How can you benefit from flexibly interchangeable
Benefit from System on Modules?

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