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phyFLEX-i.MX 91/93 FPSC
Arm® Cortex®-A55/-M33
High computing power and low energy consumption at a reasonable price.
- Robust FTGA soldering module, compatible with NXP i.MX 91 or i.MX 93.
- i.MX 91, 1x cortex®-A55 with up to 1,5GHz
- i.MX 93, 2x cortex®-A55 with up to 1,7 GHz; M-Core Realtime MCU; NPU for AI acceleration
- With display interface
- i.MX 91: parallel
- i.MX 93: MIPI-DSI and LVDS optional
- Thanks to FPSC, it's pin-compatible with all phyFLEX devices.® FPSC Gamma Modules
- Industrial interfaces: Gigabit Ethernet, CAN FD, UART
- Embedded Security: Edge Lock Secure Enclave, Secure Boot, Cryptography and more
- Integrated RAUC update client
- Fully customized Linux operating system (Yocto)
- Optional Software Lifecycle Management
The phyFLEX-i.MX 91/93 FPSC can be equipped with either the i.MX 91 or the i.MX 93 from NXP's i.MX 9x family. Thanks to NXP's innovative Energy Flex architecture, the module offers high computing performance with low energy consumption with both processors. The integrated EdgeLock® Secure Enclave enables security features such as lifecycle management, tamper detection, secure booting, and a simplified path to certifications.
Thanks to scalability within the FPSC standard, product variants and upgrades are possible throughout the product lifecycle without redesigning the carrier board. Pin compatibility with phyFLEX modules in the FPSC Gamma feature set allows for a choice of platforms in new projects after evaluating performance requirements. Even the development of different end-product variants with varying performance classes and features—for example, applications scalable in terms of price/performance ratio—is possible. Thus, the phyFLEX-i.MX 91/93 FPSC offers upgrade paths, scalable computing power, and access to the latest technologies, while simultaneously ensuring longevity. Productsn and applications ensures and improves.
The fully industrial-grade system-on-module is characterized by its cost-optimized bill of materials. Thanks to FTGA soldering technology, the module is suitable for high-volume production, significantly reducing manufacturing costs for the end application.
Bold characters mark differences between SOMs with i.MX 91 and SOMs with i.MX 93 |
| Processor | i.MX 91 | i.MX 93 |
| Core | 1x 64-bit Arm® Cortex®-A55 | up to 2x 64-bit Arm® Cortex®-A55 |
| Coprocessor | - | Arm® Cortex®-M33 |
| Clock frequency | up to 1.4 GHz (A55) | up to 1.7 GHz (A55), up to 250 MHz (M33) |
| Cache | L1: 32 kB instruction / 32 kB data (A55) L2: 256 kB (A55) | L1: 32 kB instruction / 32 kB data (A55), 32 kB (M33) L2: 64 kB per core (A55) L3: 256 kB cluster (A55) |
| Internal RAM | 384 kB SRAM | 640 kB SRAM |
| Processor extension | Arm® NEON™ and Arm® TrustZone® | Arm® NEON™ and Arm® TrustZone® |
| AI / ML | - | Arm® Ethos™-U65 microNPU |
| HW Security | Secure boot, TrustZone®, SNVS, SRTC, EdgeLock® secure enclave | Secure boot, TrustZone®, SNVS, SRTC, EdgeLock® secure enclave |
| HW Crypto Accelerator | yes | yes |
Due to multiplexing, not all interfaces may be fully available | ||
| FPSC feature set | Gamma 1.1 | Gamma 1.1 |
| FPSC subclasses | 31 | 1,2,31 |
| Ethernet | 1x 10/100 Mbit/s (on-board PHY) / 1x GbE (RMII) (optional RGMII with TSN Support) | 1x 10/100 Mbit/s (on-board PHY) / 1x GbE (RMII) (optional RGMII with TSN Support) |
| USB | 2x 2.0 host / OTG | 2x 2.0 host / OTG |
| UART | 3x, up to 8x 2 | 3x, up to 8x 2 |
| CAN | 2x CAN FD | 2x CAN FD |
| I²C | 2x , up to 8x 2 | 2x, up to 8x 2 |
| I3C | 1x | 1x |
| SPI | 2x (+1x QSPI), up to 8x (+1x QSPI)2 | 2x (+1x QSPI), up to 8x (+1x QSPI)2 |
| MMC/SD/SDIO | 2x | 2x |
| PWM | 2x , up to 24x 2 | 2x, up to 24x 2 |
| A/D | 4-channel, 12-bit | 4-channel,12-bit |
| Display | -, up to 24 bit parallel (1366x768p60 or 1280x800p60) 2 | 1x MIPI DSI: up to 1920x1200p60 (optional LVDS (both 1366x768p60 or 1280x800p60)), up to 24 bit parallel (1366x768p60 or 1280x800p60) 2 |
| Audio | 1x I²S/SAI, 1x S/PDIF, PDM input, up to 3x I²S/SAI, 1x S/PDIF, PDM input 2 | 1x I²S/SAI, 1x S/PDIF, PDM input, up to 3x I²S/SAI, 1x S/PDIF, PDM input 2 |
| Camera | -, 1x parallel up to 10-bit 2 | 1x MIPI CSI-2 (1080p60), 1x parallel up to 10-bit 2 |
| Debugging | UART, JTAG | UART, JTAG |
| Dimensions | 37 mm x 40 mm x 3 mm | 37 mm x 40 mm x 3 mm |
| Weight | tbd. | tbd. |
| Operating temperature | -40 °C to +85 °C | -40 °C to +85 °C |
| Humidity | 95 % RH, non-condensing | 95 % RH, non-condensing |
| Operating voltage | 5 V | 5 V |
| I/O voltage | 1.8 V, 3.3 V 2 | 1.8 V, 3.3 V 2 |
| Power consumption typ. | tbd. | tbd. |
| PCB connection | Fused Tin Grid Array (FTGA) (1.27 mm pitch) | Fused Tin Grid Array (FTGA) (1.27 mm pitch) |
1: Refer to the FPSC Gamma Feature Set Specifications (LAN-118e) for details about the subclasses
2: Indicates the maximum number or additional interfaces when pin compatibility according to the FPSC standard is NOT required
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