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phyCORE®-i.MX 91/93
Arm® Cortex®-A55/-M33
High processing power, low power consumption, pin-compatible with i.MX 6UL/ULL and STM32MP13x SOMs for scalable applications.
- Can be equipped with NXP i.MX 91 or i.MX 93
- i.MX 91, 1x cortex®-A55 with up to 1,5GHz
- i.MX 93, 2x cortex®-A55 up to 1,7GHz; real-time MCU; NPU
- Pin compatible to phyCORE-i.MX 6UL/ULL and phyCORE-STM32MP13x
- One endpoint design for scalable performance from 1330 DMIPS up to 9000 DMIPS
- Start of development with cost-optimized design and expansion over the course of the product life cycle
- Advanced hardware security
- Advanced security with built-in EdgeLock® Secure Enclave
- Tamper, WDT, temperature and voltage monitoring
- Integrated functionality
- up to 256GB TLC eMMC
- On-board Ethernet PHY and voltage converter circuitry
- 159-pin DSC layout supports dual LAN, dual USB, dual
CAN FD, UART, I2S /SAI, 12-bit ADC, parallel LCD,
camera etc - Dimensions 36mm x 36mm, low profile (approx. 3mm)
- Development advantages
- Fully customized Linux® operating system
- FCC/CE product reference circuit
- Worldwide technical support
- Rapid Development Kits available from 09/2023.
The phyCORE-i.MX 91/93 can be equipped with both the i.MX 91 and the i.MX 93 from the i.MX 9x family from NXP. Thanks to the innovative Energy Flex architecture from NXP, the module with both processors offers high computing power with low energy consumption. The integrated EdgeLock® Secure Enclave allows security features such as lifecycle management, tamper detection, secure booting and a simplified path to certifications. Measuring only 36 mm x 36 mm, the module enables the development of powerful, cost-effective and energy-efficient applications.
The SoM is fully pin-compatible with the best-selling phyCORE-i.MX 6UL/ULL and the new phyCORE-STM32MP13x. On the one hand, this offers the possibility of using the phyCORE-i.MX 91/93 as a successor to the i.MX 6UL/ULL in order to extend the lifespan of the entire product or to upgrade it to higher computing power and additional features such as machine learning. On the other hand, the pin compatibility with the new phyCORE-STM32MP13x allows new projects to decide on one of the platforms after evaluating the performance requirements. Even the development of different end product variants with different performance classes and features, ie applications that are scalable in terms of price/performance ratio, is possible. The new phyCORE-i.MX 91/93 offers upgrade paths, scalable computing power and access to the latest technologies, while at the same time maintaining the longevity of Productsn and applications ensures and improves.
The fully industrial grade phyCORE-i.MX 91/93 is characterized by its price-optimized bill of material. Thanks to Direct Solder Connect technology, the module is suitable for large-scale production and the manufacturing costs of the end application are significantly reduced.
Product presentation of the phyCORE-i.MX 93 at Embedded World 2023
Bold characters mark differences between SOMs with i.MX 91 and SOMs with i.MX 93 |
| Processor | i.MX 91 | i.MX 93 |
| Core | 1x 64-bit Arm® Cortex®-A55 | up to 2x 64-bit Arm® Cortex®-A55 |
| Coprocessor | - | Arm® Cortex®-M33 |
| Clock frequency | up to 1.4 GHz (A55) | up to 1.7 GHz (A55), up to 250 MHz (M33) |
| Cache | L1: 32 kB instruction / 32 kB data (A55) L2: 256 kB (A55) | L1: 32 kB instruction / 32 kB data (A55), 32 kB (M33) L2: 64 kB per core (A55) L3: 256 kB cluster (A55) |
| Internal RAM | 384 kB SRAM | 640 kB SRAM |
| Processor extension | Arm® NEON™ and Arm® TrustZone® | Arm® NEON™ and Arm® TrustZone® |
| AI / ML | - | Arm® Ethos™-U65 microNPU |
| HW Security | Secure boot, TrustZone®, SNVS, SRTC, EdgeLock® secure enclave | Secure boot, TrustZone®, SNVS, SRTC, EdgeLock® secure enclave |
| HW Crypto Accelerator | yes | yes |
| Ethernet | 1x 10/100 Mbit/s (on-board PHY) / 1x GbE (RMII) (optional RGMII with TSN Support) | 1x 10/100 Mbit/s (on-board PHY) / 1x GbE (RMII) (optional RGMII with TSN Support) |
| USB | 2x 2.0 host / OTG | 2x 2.0 host / OTG |
| UART | 3x (up to 8) | 3x (up to 8) |
| CAN | 1x (up to 2) CAN FD | 1x (up to 2) CAN FD |
| I²C | 1x (up to 8) (2x I3C) | 1x (up to 8) (2x I3C) |
| SPI | 1x (up to 8) | 1x (up to 8) |
| MMC/SD/SDIO | 1x (up to 2) | 1x (up to 2) |
| PWM | 1x (up to 8) | 1x (up to 8) |
| A/D | 3-channel, 12-bit | 3-channel,12-bit |
| Display | 1x parallel up to 24-bit | 1x parallel up to 24-bit (optional LVDS) |
| Audio | 3x I²S/SAI, 1x S/PDIF, PDM input | 3x I²S/SAI, 1x S/PDIF, PDM input |
| Camera | -, (optional 1x parallel up to 8-bit) | 1x MIPI CSI-2 (1080p60), (optional 1x parallel up to 8-bit) |
| Debugging | JTAG | JTAG |
| Dimensions | 36 mm x 36 mm x 3 mm | 36 mm x 36 mm x 3 mm |
| Weight | approx. 6.2 g | approx. 6.2 g |
| Operating temperature | -40 °C to +85 °C | -40 °C to +85 °C |
| Humidity | 95 % rF non condensing | 95 % rF non condensing |
| Operating voltage | 3.3 V | 3.3 V |
| Power consumption typ. | tbd. | tbd. |
| Connector | 159 plated half-holes, 1 mm pitch | 159 plated half-holes, 1 mm pitch |
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