Interchangeable System on Modules:
Phytec presents phyFLEX product line

Mainz, November 05, 2025
Phytec presents phyFLEX, a new product line of flexibly interchangeable System-on-Modules (SoMs). Based on the FPSC footprint for soldered SoMs, they enable upgrades and product variants across processor families and manufacturers. Currently available are phyFLEX SoMs with the STMicroelectronics STM32MP2x, Texas Instruments AM62L, and NXP i.MX 8M Plus and i.MX 95 processors.
Interchangeability without compromise
The phyFLEX System-on-Modules (SoMs) stand for uncompromising interchangeability and complement the plug-in and solder-in modules of the phyCORE series. The phyFLEX series is based on the FPSC footprint pinout, where signals are divided into three categories: Mandatory Signals for maximum compatibility, which are identical for all current and future modules within a feature set; Optional Signals, which are supported by many processors and are also intended to be considered for future SoMs within the FPSC feature set; and Specialized Signals, which are not standardized and enable the use of specific processor features. Companies can use these signal categories to determine the level of functionality and pin compatibility that best suits their projects and applications.
By using mandatory and optional signals, which together account for over 80 percent of all signals, module replacement is guaranteed in the long term without modifications to the carrier board. This helps customers leverage technology trends, protect themselves against supply bottlenecks, and implement product variants and upgrades with increased computing power, memory, etc.
Bodo Huber, Managing Director of Phytec, says about the new phyFLEX product line:
“Many customers have responded very positively to our concept of flexibly interchangeable modules. Some use the SoMs to offer different product variants with the same carrier board. Others rely on FPSCs for future-proofing, knowing they can maintain their design even with new processor generations. And a third group uses the SoMs because they are compact, cost-optimized, and robust – without having to worry about upgrades or product variants right now. With the new phyFLEX product line, we want to further strengthen this concept of uncompromising interchangeability.”
Robust, easy to process and cost-effective
All current phyFLEX SoMs utilize the FPSC footprint and FTGA (Fused Tin Grid Array) soldering technology. This enables high-strength solder joints, with fixing points providing mechanical coupling between the SoM and the carrier board. They are also easy to process and cost-optimized for mass production.
From BSP to security and CRA compliance: Support for development
Phytec offers comprehensive services for its phyCORE and phyFLEX series System on Modules – from developing customized hardware and software to embedded imaging integration, security, updates, and device management. This also includes supporting customers in meeting requirements of CRA, RED, and other standards, or completely handling CVE testing and lifecycle management for hardware and software.
About PHYTEC
PHYTEC Messtechnik GmbH, the largest company within PHYTEC Technologie Holding AG, develops and produces embedded components for global use in industrial series products at its Mainz location. The range of services includes system-on-modules, single-board computers, customized electronics, and complete OEM solutions including software, housing design, and complete assembly. Developments and offerings for embedded vision and solutions for topics such as security, update and device management, lifecycle management, and cloud integration are also part of the PHYTEC portfolio.
For more than 35 years, PHYTEC embedded systems and solutions have proven themselves under the most demanding conditions, including in medical technology, traffic and transportation, the energy industry, avionics, building automation, drive technology, agricultural technology, and the automotive sector. The family-owned company employs approximately 390 people in five offices worldwide.