phyCORE®-i.MX 8M Plus
ARM CortexTM-A53/-M7
The phyCORE-i.MX 8 M Plus, not only for edge applications, but especially suitable for them. Based on the NXP i.MX 8M Plus SoC, the phyCORE-i.MX 8M Plus is PHYTEC's most intelligent module. Equipped with up to 4 Cortex-A53, one Cortex-M7 for real-time applications, and a unique combination of a variety of multimedia interfaces with a powerful NPU (Neural Processing Unit), the i.MX 8M Plus SoC is ideally suited for machine learning (ML), image processing, advanced multimedia and industrial IoT applications.
The scalable and size-optimized phyCORE-i.MX 8M Plus is the perfect basis for utilizing all i.MX 8M Plus functions in areas where intelligent and fast processing of multimedia data is required in a confined space. This could be e.g. in a smart home (e.g. home automation), the intelligent city (e.g. people/traffic monitoring), industry 4.0 (e.g. intelligent robot control, HMI) or in IIoT applications (e.g. edge computing).
With the phyCORE-i.MX 8M Plus, the necessary, highly complex parts of the circuit design are already done, which makes application development simple and cost-effective. Due to the compact size of the module (40 mm x 37 mm x 6 mm (with connectors) / 3 mm (solder module)) and the fact that almost all interfaces are available at the module connector, the phyCORE-i.MX 8M Plus can also be used in all application areas the i.MX 8M Plus is intended for.
Highlights:
- Neural Processing Unit
- 2x Image Signal Processor + 2x MIPI CSI-2
- HiFi Audio DSP
- 2x LVDS, MIPI DSI-2, HDMI
- Real-time control with Cortex-M7
- 2x GB Ethernet with TSN, 2x CAN FD, 2x USB3.0
- High reliability (DRAM inline ECC, ECC on on-chip RAM)
PHYTEC modules support comprehensive security features in hardware and software. All functions supported by the i.MX 8M Mini processor as well as further information about our security concept can be found here.

Technical Details
phyCORE-i.MX 8M Plus | phyBOARD-Pollux Kit | phyBOARD-Pollux AI Kit | phyBOARD-Pollux Imaging Kit | ||||
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Product | System on Module | Development Kit | Development Kit | Development Kit | |||
Processor | i.MX 8M Plus Dual/Quad | i.MX 8M Plus Quad | i.MX 8M Plus Quad | i.MX 8M Plus Quad | |||
Bit width | 64-bit | 64-bit | 64-bit | 64-bit | |||
Architecture | ARM Cortex-A53 / Cortex-M7 | ARM Cortex-A53 / Cortex-M7 | ARM Cortex-A53 / Cortex-M7 | ARM Cortex-A53 / Cortex-M7 | |||
Frequency | up to 1.8 GHz (A53) 1x 800 MHz (M7) | 4x 1.8 GHz (A53) 1x 800 MHz (M7) | 4x 1.8 GHz (A53) 1x 800 MHz (M7) | 4x 1.8 GHz (A53) 1x 800 MHz (M7) | |||
DSP | Tensilica HiFi 4 DSP with 800 MHz | Tensilica HiFi 4 DSP with 800 MHz | Tensilica HiFi 4 DSP with 800 MHz | Tensilica HiFi 4 DSP with 800 MHz | |||
Graphics | 3D GPU (2 shader, 16 GFLOPs GC7000UL OpenCL/GL/Vulkan), 2D GPU (GC520) | 3D GPU (2 shader, 16 GFLOPs GC7000UL OpenCL/GL/Vulkan), 2D GPU (GC520) | 3D GPU (2 shader, 16 GFLOPs GC7000UL OpenCL/GL/Vulkan), 2D GPU (GC520) | 3D GPU (2 shader, 16 GFLOPs GC7000UL OpenCL/GL/Vulkan), 2D GPU (GC520) | |||
Video | 1080p60 H.265/4 Decode and Encode | 1080p60 H.265/4 Decode and Encode | 1080p60 H.265/4 Decode and Encode | 1080p60 H.265/4 Decode and Encode | |||
AI/ML | Neural Processing Unit with 2.3 TOPS | Neural Processing Unit with 2.3 TOPS | Neural Processing Unit with 2.3 TOPS | Neural Processing Unit with 2.3 TOPS | |||
Crypto | RDC, CAAM, PKHA, RSA, EEC, RTIC, DRM, AES, 3DES, DES, RNG | RDC, CAAM, PKHA, RSA, EEC, RTIC, DRM, AES, 3DES, DES, RNG | RDC, CAAM, PKHA, RSA, EEC, RTIC, DRM, AES, 3DES, DES, RNG | RDC, CAAM, PKHA, RSA, EEC, RTIC, DRM, AES, 3DES, DES, RNG | |||
MEMORY | |||||||
SPI NOR Flash | 8 MB up to 256 MB | 64 MB | |||||
eMMC | 4 GB up to 128 GB | 8 GB | |||||
LPDDR4 RAM | 512 MB up to 4 GB (32 Bit) | 2 GB | |||||
EEPROM | 4 kB | 4 kB | |||||
INTERFACES | |||||||
Ethernet | 1x 10/100/1000 Mbit/s | 1x 10/100/1000 Mbit/s | |||||
USB | 2x USB2.0 OTG |
1x USB2.0 OTG, 1x USB2.0 |
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Serial | - | 1x RS232 or RS485 | |||||
CAN | - | 1x CAN FD | |||||
UART | 4x | up to 3x | |||||
PCI / PCIe | 1x | 1x miniPCIe | |||||
I²C | 3x | 1x | |||||
SPI | 2x | 1x | |||||
MMC/SD/SDIO | 2 | micro SD-Card | |||||
PWM | up to 4x | - | |||||
Display | MIPI DSI-2 | MIPI DSI or FlatLink LVDS via A/V connector | |||||
Audio | 4x SAI | SAI via A/V Connector, Voice Array Connector | |||||
Camera | MIPI CSI-2 | 1x MIPI-CSI | |||||
RTC | Low power, high precision external RTC | Real Time Clock (mounted on SoM) with Gold Cap Backup | |||||
Power Supply | 3.3 V | 12-24 V via Power Adapter | |||||
Dimensions | 40 mm x 37 mm | 100 mm x 100 mm | |||||
Connectors | BGA (301) | BGA (301) | |||||
Temperature range | -40°C up to +85°C | -40°C up to +85°C | |||||
SOFTWARE | |||||||
Operating system | Linux | Linux | |||||
Distribution | Yocto | Yocto | |||||
Debug Interface | UART, JTAG | UART, JTAG |
Please use our contact form and get in touch with PHYTEC to receive more information about the i.MX 8 product family and discuss your project with us.