NXP i.MX 8

Family

The function and performance scalable multicore platforms of the i.MX 8 family with single, dual and quad core processors are based on the Arm Cortex architecture (Cortex-A72, Cortex-A53, Cortex-A35, Cortex-M4 and Cortex-M7) and offer you powerful solutions for:

Graphics, imaging and machine vision
Security-critical applications
Audio, video, AI applications

Processor block diagrams:

Gamme plates based on NXP imx8 — 8M Plus

Open comparison table of all i.MX 8 variants

Overview

	phyCORE-i.MX 8M Plus FPSC	phyCORE-i.MX 8M Mini	phyCORE-i.MX 8M Nano	phyCORE-i.MX 8M	phyCORE-i.MX 8	phyCORE-i.MX 8X
Features	Neural Processing Unit (NPU), Image Signal Processor (ISP)	Low cost, VPU	Low-Cost	4kp60 HEVC/H.265 and HDMI	2 GPUs, HDMI, SATA	1 GPU, NAND Flash
Applications			Download English PDF
Associated development kit	phyBOARD Pollux Development Kit	phyBOARD Polis Development Kit	phyBOARD Polis Development Kit	phyBOARD Polaris Development Kit	On request	phyCORE-i.MX 8X Alpha Kit
CPU	Quad / QuadLite: 4x Cortex-A53 (1.8 GHz) dual: 2x Cortex-A53 (1.8GHz)	Quad / QuadLite: 4x Cortex-A53 (1.8GHz) Dual / DualLite: 2x Cortex-A53 (1.8GHz) Solo / SoloLite: 1x Cortex-A53 (1.8GHz)	Quad / QuadLite: 4x Cortex-A53 (1.5 GHz) Dual / DualLite: 2x Cortex-A53 (1.5 GHz) Solo / SoloLite: 1x Cortex-A53 (1.5GHz)	Quads: 4x Cortex-A53 (1.5 GHz) dual: 2x Cortex A53 (1.5 GHz) QuadLite: 4x Cortex-A53 (1.5GHz)	Quad Max: 2x Cortex-A72 (1.6 GHz) 4x Cortex-A53 (1.2 GHz) QuadPlus: 1x Cortex-A72 (1.6GHz) 4x Cortex-A53 (1.2GHz)	QuadXPlus: 4x Cortex-A35 (1.2 GHz) DualXPlus: 2x Cortex-A35 (1.2 GHz) DualX: 2x Cortex-A35 (1.2GHz)
Brand	ARM Cortex-A53 / Cortex-M7	ARM Cortex-A53 / Cortex-M4	ARM Cortex-A53 / Cortex-M7	ARM Cortex-A53 / Cortex-M4	ARM Cortex-A53 / Cortex-A72 / Cortex-M4F	ARM Cortex-A35 / Cortex-M4F
Instruction Set	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit
Frequency	up to 1.8 GHz	up to 1.8 GHz	up to 1.5 GHz	up to 1.5 GHz	up to 1.6 GHz	up to 1.2 GHz
Economical performance	max 16,560 DMIPS	3450 to 16,560 DMIPS	3450 to 13,800 DMIPS	3450 to 13,800 DMIPS	5860 ton 28,650 DMIPS	5040 to 7240 DMIPS
DSP	Tensilica HiFi 4 800 MHz	-	-	-	Tensilica HiFi 4 666 MHz	Tensilica HiFi 4 666 MHz
Neural Network Accelerator	2,3 TOPS	-	-	-	-	-
GPU	GC7000UL (2 shaders) 166 million triangles / s 1.0 giga pixel / s 16 GFLOPs 32-bit	GC NanoUltra 3D (1 shader) + GC30 2D (6,4 GFLOPs)	GC7000UltraLite (2 shaders)	GC7000Light (4 shader) (25,6 GFLOPs)	2 x GC7000XS / VX (8 shader) (128 GFLOPS)	GC7000Light (4 shaders) (25,6 GFLOPs)
OpenGL / VG / CL	OpenGL ES 2.0 / 3.0 / 3.1, Vulkan, OpenCL1.2	OpenGL / ES 1.1, 2.0, OpenVG 1,1, Vulkan	OpenGL ES 3.1, Vulkan, OpenCL 1.2	OpenGL / ES 1.1, 2.0, 3.0, 3.1, OpenCL1.1 / 1.2FP, Vulkan	OpenGL / ES3.2, 3.1, 3.0 (2.x, 1.x), OpenVX 1.01, OpenCL2.0 16 Vec4 shaders with 64 execution units (Split GPU for dual independent 8-Vec4 shader GPUs possible), OpenVG1.1, volcano	OpenGL / ES 1.1, 2.0, 3.0, 3.1 OpenCL 1.2 FP, Vulkan
ISP (Image Signal Processor)	2x ISP up to 12 MP resolution	-	-	-	-	-
VPU	Decode: 1080p60 video decoding (H.265, H.264, VP9, VP8) Encode: 1080p60 video (H.265, H.264)	Decode: 1080p60 VP9 decoder, 1080p60 HEVC / H.265, 1080p60 AVC / H.264, 1080p60 VP8, Encode: 1080p60 AVC / H.264 encoder, 1080p60 VP8 encoder	-	decode: 4kp60 HEVC / H.265, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVC, MJPEG, H.263	Decode: 4kp30 H.265, 1080p60 H.264,1080p30 H.264	Decode: 4kp30 H.265, 1080p60 H.264,1080p30 H.264
HW security	Secure boot, TrustZone, SNVS, SRTC, SJC	HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG	HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG	HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG	HAB secure boot, Arm TrustZone®, RNG, RSA up to 4096, AES- 128/192/256, 3DES, ARC4, MD-5, SHA up to 512, flashless SHE, ECC, secure JTAG, 4x tamper pins	HAB secure boot, TrustZone, RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 512, flashless SHE, ECC, secure JTAG, 10x tamper pins
HW Crypto	RDC, CAAM, PKHA, RSA, EEC, RTIC, DRM, RSA, AES, 3DES, DES, RNG	AES, RSA, SHA-256, 3DES, DES, ECC, ARC4, MD5, TRNG	AES, RSA, SHA-256, 3DES, DES, ECC, ARC4, MD5, TRNG	AES, 3DES, RSA, ECC Ciphers, SHA1 / 256, TRNG	AES, 3DES, RSA, ECC Ciphers, SHA1 / 256, TRNG	AES, 3DES, RSA, ECC Ciphers, SHA1 / 256, TRNG

Memory

	phyCORE-i.MX 8M Plus FPSC	phyCORE-i.MX 8M Mini	phyCORE-i.MX 8M Nano	phyCORE-i.MX 8M	phyCORE-i.MX 8	phyCORE-i.MX 8X
NAND Flash	-	-	-	-	-	128MB to 1GB (optionally with eMMC)
SPI NOR Flash	4MB - 256MB Quad SPI Flash	8 MB - 256 MB Quad SPI Flash	8 MB - 256 MB Quad SPI Flash	8 MB - 256 MB Quad Spi Flash	64 MB - 256 MB Octal SPI / Dual SPI Flash	64 MB - 256 MB Octal SPI / Dual SPI Flash
eMMC	4GB - 64GB eMMC 5.1	4GB - 128GB	4GB - 128GB	4GB - 128GB	4GB - 128GB	4GB - 128GB (optionally with NAND Flash)
LPDDR4 RAM	512 MB - 4 GB (32 bit) x16 or x32 LPDDR4 / Inline ECC	512 MB - 4 GB (32 bit)	256 MB - 2 GB (16 bit)	512 MB - 4 GB (32 bit)	1GB - 8GB (64 bit)	512 MB - 4 GB (32 bit)
EEPROM	4KB - 32KB	4 kB	4 kB	4 kB	4 KB	4 kB

Interfaces

	phyCORE-i.MX 8M Plus FPSC	phyCORE-i.MX 8M Mini	phyCORE-i.MX 8M Nano	phyCORE-i.MX 8M	phyCORE-i.MX 8	phyCORE-i.MX 8X
Ethernet	2x 10/100/1000 Mbit / s (1xTSN)	1x 10/100/1000 Mbit / s	1x 10/100/1000 Mbit / s	1x 10/100/1000 Mbit / s	2x 10/100/1000 Mbit / s (1x onboard / 1x RGMII)	2x 10/100/1000 Mbit / s (1x onboard / 1x RGMII)
USB	2x USB 3.0 Type-C with PHY	2x USB 2.0 OTG	1x USB 2.0 OTG	2x USB 3.0	1xOTG, 1x USB 3.0	1xOTG, 1x USB3.0
UART	4x	4x	4x	4x	2x	2x
CAN	2x (1x CAN FD)	possible via SPI to CAN-FD converter	possible via SPI to CAN-FD converter	possible via SPI to CAN-FD converter	2x	3x
PCI/PCIe	1x PCIe Gen 3	1x	-	1x	2x	1x
I²C	3x	3x	3x	4x	Up to 19x	Up to 10x
SPI	3x ECSPI	2x	2x	OSPI 2x SPI	up to 4x + 1x QSPI	1x OCTAL SPI or 2x Quad SPI + 3 SPI
MMC / SD / SDIO	3x SDIO (1 used for eMMC)	2x	2x	1xSDIO	2x	1x (only with eMMC available)
Keypad	-	-	-	-	1x	Yes
PWM	4x PWM, 6x timer	Up to 4x	4x	4x	Yes	Yes
TO	via I²C AD converter	via I²C AD converter	via I²C AD converter	via I²C AD converter	8x	6x
SATA	-	-	-	-	1x	-
Display	LVDS (4/8 lanes), MIPI DSI (4 lanes), HDMI 2.0a Tx	LVDS or DSI-2 (1x 1080p60)	LVDS or DSI-2 (1x 1080p60)	MIPI DSI, HDMI (1x 4Kp60 HDR and 1x 1080p60)	2x LVDS, 2x MIPI DSI, 1x HDMI (1x UltraHD 4Kp60 display or up to 4x independent FullHD 1080p60 displays)	2x LVDS or 2x MIPI DSI, 1x parallel (2x 1080p, 1x WVGA)
Audio	18x I²S TDM (32 b @ 384 KHz), ASRC, 8-ch. PDM DMIC input, eARC	4x SAI	4x SAI	5x SAI	2x SAI up to 4 SAI	4x SAI
Room	2x MIPI CSI (4 lanes each)	1x MIPI CSI-2	1x MIPI CSI-2	2x MIPI CSI	2x MIPI CSI, 1x HDMI in	1x MIPI CSI, 1x parallel

Physical data

	phyCORE-i.MX 8M Plus FPSC	phyCORE-i.MX 8M Mini	phyCORE-i.MX 8M Nano	phyCORE-i.MX 8M	phyCORE-i.MX 8	phyCORE-i.MX 8X
RTC	Low-power, high-precision external RTC	Low-power, high-precision external RTC	Low-power, high-precision external RTC	i.MX 8 internal	i.MX 8 internal	i.MX 8 internal
Power Supplies	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Size	40 mm x 37 mm	40 mm x 37 mm	40 mm x 37 mm	55 mm x 40 mm	73 mm x 45 mm	52 mm x 42 mm
Connectors	Samtec (2x 120 pins + 1x 60 pins) or Fused Tin Grid Array (FTGA)	319 solder pads, 1.27mm pitch Fused Tin Grid Array (FTGA)	319 solder pads, 1.27mm pitch Fused Tin Grid Array (FTGA)	501 solder pads, 1.27mm pitch Fused Tin Grid Array (FTGA)	Samtec 0.5 mm pitch (480 pins)	Samtec 0.5 mm pitch (280 pins)
temperature range	-40 ° C to + 85 ° C	-40 ° C to + 85 ° C	-40 ° C to + 85 ° C	-40 ° C to + 85 ° C	-40 ° C to + 85 ° C	-40 ° C to + 85 ° C

Comparison table for all variants

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NXP i.MX 8